leshan radio company, ltd. 2?input nand gate v1 d l7 4 vhc1g00 v1 d 1 3 2 4 5 sot?23/tsop?5/sc?59 dt suffix the l 74vhc1g00 is an advanced high speed cmos 2?input nand gate fabricated with silicon gate cmos technology. it achieves high speed operation similar to equivalent bipolar schottky ttl while maintaining cmos low power dissipation. the internal circ uit is composed of multiple stages, including a buffer output which provides high noise immunity and stable output. the l 74vhc1g00 in put structure provides protection when voltages up to 7 v are applied, regardless of the supply voltage. this allows the l 74vhc1g0 0 to be used to interface 5 v circuits to 3 v circuits. high speed: t pd = 3.0 ns (typ) at v cc = 5 v low power dissipation: i cc = 2 ma (max) at t a = 25c power down protection provided on inputs balanced propagation delays pin and function compatible with other standard logic families sc?70/sc?88a/sot?353 df suffix 1 3 2 4 5 marking diagrams pin 1 d = date code pin 1 d = date code figure 1. pinout (top view) figure 2. logic symbol pin assignment 1 in b 2 in a 3 gnd 4 out y 5v cc function table inputs ou tput ab y ll h lh h hl h hh l ordering information see detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. 1/6
leshan radio company, ltd. l 74vhc1g00 maximum ratings symbol parameter value unit v cc dc supply voltage ? 0.5 to + 7.0 v v in dc input voltage ? 0.5 to v cc + 0.5 v v out dc output voltage ? 0.5 to v cc + 0.5 v i ik dc input diode current 20 ma i ok dc output diode current 20 ma i out dc output sink current 12.5 ma i cc dc supply current per supply pin 25 ma t stg storage temperature range ? 65 to + 150 c t l lead temperature, 1 mm from case for 10 seconds 260 c t j junction temperature under bias + 150 c ja thermal resistance sc?70/sc?88a (note 1) 150 c/w tsop?5 200 p d power dissipation in still air at 85c sc?70/sc?88a 150 mw tsop?5 230 msl moisture sensitivity level 1 f r flammability rating oxygen index: 30% ? 35% ul 94 v?0 (0.125 in) v esd esd withstand voltage human body model (note 2) >2000 v machine model (note 3) > 200 charged device model (note 4) n/a i latch?up latch?up performance above v cc and below gnd at 85c (note 5) 500 ma maximum ratings are those values beyond which damage to the device may occur. exposure to these conditions or conditions beyond those indicated may adversely affect device reliability. functional operation under absolute?maximum?rated conditions is not implied. functional operation should be restricted to the recommended operating conditions. 1. measured with minimum pad spacing on an fr4 board, using 10 mm?by?1 inch, 2?ounce copper trace with no air flow. 2. tested to eia/jesd22?a114?a. 3. tested to eia/jesd22?a115?a. 4. tested to jesd22?c101?a. 5. tested to eia/jesd78. recommended operating conditions symbol parameter min max unit v cc dc supply voltage 2.0 5.5 v v in dc input voltage 0.0 5.5 v v out dc output voltage 0.0 v cc v t a operating temperature range ? 55 + 125 c t r ,t f input rise and fall time v cc = 3.3 0.3 v 0 100 ns/v v cc = 5.0 0.5 v 0 20 device junction temperature versus time to 0.1% bond failures junction t ime, time, temperature c hours y ears 80 1,032,200 117.8 90 419,300 47.9 100 178,700 20.4 110 79,600 9.4 120 37,000 4.2 130 17,800 2.0 140 8,900 1.0 normalized failure rate figure 3. failure rate vs. time junction temperature 1 1 10 100 1000 time, years 2/6
leshan radio company, ltd. dc electrical characteristics v cc t a = 25 c t a < 85 c ?55 c to 125 c symbol parameter test conditions (v) min typ max min max min max unit v ih minimum high?level 2.0 1.5 1.5 1.5 v input voltage 3.0 2.1 2.1 2.1 4.5 3.15 3.15 3.15 5.5 3.85 3.85 3.85 v il maximum low?level 2.0 0.5 0.5 0.5 v input voltage 3.0 0.9 0.9 0.9 4.5 1.35 1.35 1.35 5.5 1.65 1.65 1.65 v oh minimum high?level v in = v ih or v il 2.0 1.9 2.0 1.9 1.9 v output voltage i oh = ? 50 a 3.0 2.9 3.0 2.9 2.9 v in = v ih or v il 4.5 4.4 4.0 4.4 4.4 v in = v ih or v il i oh = ?4 ma 3.0 2.58 2.48 2.34 i oh = ?8 ma 4.5 3.94 3.80 3.66 v ol maximum low?level v in = v ih or v il 2.0 0.0 0.1 0.1 0.1 v output voltage i ol = 50 a 3.0 0.0 0.1 0.1 0.1 v in = v ih or v il 4.5 0.0 0.1 0.1 0.1 v in = v ih or v il i ol = 4 ma 3.0 0.36 0.44 0.52 i ol = 8 ma 4.5 0.36 0.44 0.52 i in maximum input v in = 5.5 v or gnd 0 to5.5 0.1 1.0 1.0 a leakage current i cc maximum quiescent v in = v cc or gnd 5.5 2.0 20 40 a supply current l 74vhc1g00 ac electrical characteristics c load = 50 pf, input t r = t f = 3.0 ns t a = 25 c t a < 85 c ?55c leshan radio company, ltd. device ordering information l 74vhc1g00 device nomenclature device order number logic circuit indicator temp range identifier technology device function package suffix tape and reel suffix package type (name/sot#/ common name) tape and reel size l 74vhc1g00dft 1 l 7 4 v hc1g 0 0 d f t 1 s c?70/sc?88a/ 1 78 mm (7 in) sot?353 3000 unit l 74vhc1g00dft2 l 74 vhc1g 00 df t2 sc?70/sc?88a/ 178 mm (7 in) sot?353 3000 unit l 74vhc1g00dtt1 l 74 vhc1g 00 dt t1 sot?23/tsop?5/ 178 mm (7 in) sc? 59 3000 unit 4/6
leshan radio company, ltd. l 74 v hc1g0 0 package dimensions notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. 419a?01 obsolete. new standard 419a?02. 4. dimensions a and b do not include mold flash, protrusions, or gate burrs. dim a min max min max millimeters 1.80 2.20 0.071 0.087 inches b 1.15 1.35 0.045 0.053 c 0.80 1.10 0.031 0.043 d 0.10 0.30 0.004 0.012 g 0.65 bsc 0.026 bsc h --- 0.10 --- 0.004 j 0.10 0.25 0.004 0.010 k 0.10 0.30 0.004 0.012 n 0.20 ref 0.008 ref s 2.00 2.20 0.079 0.087 b 0.2 (0.008) mm 12 3 4 5 a g s d 5 pl h c n j k ?b? sc70?5/sc?88a/sot?353 df suffix soldering footprint* mm inches scale 20:1 0.65 0.025 0.65 0.025 0.50 0.0197 0.40 0.0157 1.9 0.0748 5/6
leshan radio company, ltd. l 74 v hc1g0 0 package dimensions notes: 1. dimensioning and tolerag per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. maximum lead thickness includes lead finish thickness. minimum lead thickness is the minimum thickness of base material. 4. a and b dimensions do not include mold flash, protrusions, or gate burrs. dim min max min max inches millimeters a 2.90 3.10 0.1142 0.1220 b 1.30 1.70 0.0512 0.0669 c 0.90 1.10 0.0354 0.0433 d 0.25 0.50 0.0098 0.0197 g 0.85 1.05 0.0335 0.0413 h 0.013 0.100 0.0005 0.0040 j 0.10 0.26 0.0040 0.0102 k 0.20 0.60 0.0079 0.0236 l 1.25 1.55 0.0493 0.0610 m 0 10 0 10 s 2.50 3.00 0.0985 0.1181 0.05 (0.002) 123 54 s a g l b d h c k m j __ _ _ sot23?5/tsop?5/sc59?5 dt suffix 0.7 0.028 1.0 0.039 mm inches scale 10:1 0.95 0.037 2.4 0.094 1.9 0.074 soldering footprint* 6/6
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